High-Speed Microcomponent Assembly Engineer
2 dagen geleden
About this Opportunity
TNO, a leading innovation center, is seeking a highly skilled High-Speed Microcomponent Assembly Engineer to join our team. This exciting opportunity will enable you to work on cutting-edge technology, pushing the boundaries of miniaturization in electronics.
Job Summary
We are looking for an ambitious and independent individual with excellent communication skills in English. As a key member of our team, you will be responsible for optimizing the filling parameters of our automatic coating setup using laser-based technology. Your findings will be used to design and build a dedicated filling tool, further advancing the development of high-throughput assembly processes.
Responsibilities
- Conduct thorough literature research and collaborate with colleagues to gain a deep understanding of the subject matter.
- Perform experiments in our state-of-the-art clean-room labs, analyzing data and presenting results effectively.
- Document your findings in a technical report and actively participate in technical meetings and internal seminars.
Requirements
To succeed in this role, you should possess a strong background in mechanical engineering, materials science, or physics. Excellent problem-solving skills, attention to detail, and effective communication are essential.
Benefits
This internship offers a unique chance to work on a project that could shape the future of electronics. You will be part of a collaborative environment where your input is valued and encouraged. A suitable compensation package will be provided, ensuring your professional growth and development.
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