Chemical Engineering Internship: Debonding of Adhesives

5 dagen geleden


Eindhoven, Noord-Brabant, Nederland ASML Voltijd
Background Information

The Sensors Mechanics group, part of the Mechanical Development cluster, is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair.

Your Assignment

In this internship, you will focus on debonding epoxy glue connections and removing glue remnants from sensor parts. This requires a dedicated debonding process, taking into account particle defectivity and outgassing. You will investigate available debonding processes, determine specifications, and conduct experiments to improve the debonding process.

Requirements
  • Master's student with a background in chemistry, materials science, or equivalent expertise
  • Interest in making a next step in reuse and sustainability
  • Self-propelling, solution-oriented, communicative student with a pro-active approach and hands-on mentality
What We Offer

This is a graduation/apprentice internship for 5 days a week, with a duration of 5-9 months, starting in September. You will gain valuable experience in a highly innovative environment, working in a dynamic team and receiving practical guidance from experts in the field. You will also receive a monthly internship allowance of maximum €600, plus possible housing allowance and free public transport.

About ASML

ASML is a high-tech company headquartered in the Netherlands, manufacturing complex lithography machines for chipmakers. We believe in the importance of diversity and inclusion, and we are an Equal Opportunity Employer. We recognize that diversity and inclusion are driving forces in the success of our company.



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