Chemical Engineering Internship: Debonding of Adhesives
5 dagen geleden
The Sensors Mechanics group, part of the Mechanical Development cluster, is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair.
Your AssignmentIn this internship, you will focus on debonding epoxy glue connections and removing glue remnants from sensor parts. This requires a dedicated debonding process, taking into account particle defectivity and outgassing. You will investigate available debonding processes, determine specifications, and conduct experiments to improve the debonding process.
Requirements- Master's student with a background in chemistry, materials science, or equivalent expertise
- Interest in making a next step in reuse and sustainability
- Self-propelling, solution-oriented, communicative student with a pro-active approach and hands-on mentality
This is a graduation/apprentice internship for 5 days a week, with a duration of 5-9 months, starting in September. You will gain valuable experience in a highly innovative environment, working in a dynamic team and receiving practical guidance from experts in the field. You will also receive a monthly internship allowance of maximum €600, plus possible housing allowance and free public transport.
About ASMLASML is a high-tech company headquartered in the Netherlands, manufacturing complex lithography machines for chipmakers. We believe in the importance of diversity and inclusion, and we are an Equal Opportunity Employer. We recognize that diversity and inclusion are driving forces in the success of our company.
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Chemical Engineering Internship: Debonding of Adhesives
3 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdAbout the RoleWe are seeking a highly motivated and detail-oriented Chemical Engineering Intern to join our team at ASML. As a Chemical Engineering Intern, you will be responsible for debonding adhesives and removing glue remnants from sensor parts.Key ResponsibilitiesConduct a literature study on available debonding processes for specific...
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Chemical Engineering Internship: Debonding of Adhesives
7 dagen geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group at ASML is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair.Your AssignmentIn this internship,...
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Chemical Engineering Internship: Debonding of Adhesives
1 week geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentIn this internship, you...
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Chemical Engineering Internship: Debonding of Adhesives
7 dagen geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group at ASML is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentThis internship...
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Chemical Engineering Internship: Debonding of Adhesives
5 dagen geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, focuses on designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair.Your AssignmentThis internship focuses on...
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Chemical Engineering Internship: Debonding of Adhesives
2 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group at ASML is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentThis internship...
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Chemical Engineering Internship: Debonding of Adhesive Bonds
2 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, focuses on designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair.Your AssignmentThis internship involves debonding...
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Chemical Engineering Internship: Debonding of Adhesives
3 dagen geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair.Your AssignmentAs part of this effort, you...
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