Internship | Laser-Assisted High-throughput Microcomponent Assembly
6 maanden geleden
About this position
One of the key expertise areas of TNO/Holst Centre is Laser-Assisted High-throughput Microcomponent Assembly. With the growing demand for ever-smaller devices, such as mini- and microLED displays with higher resolution rates, there is an unstoppable trend towards miniaturisation of components. High-speed, mass-production of these electronics is getting more and more difficult, because the handling and accurate placement of these tiny components is very challenging. Each component needs to be carefully selected, transferred and then accurately placed and assembled with interconnects – all at lightning speeds. As conventional industrial equipment fail to deposit ultrafine pattens of die attach material and handle such tiny components at required high rates, this calls for development of alternative high-throughput assembly technologies.
What will be your role?
As you can imagine, a lot of things need to fall into place in order to make this happen. One important piece of this puzzle is the placement of the die attach material, which will make both a physical and electrical connection of the component to the substrate. At Holst Centre we developed a laser based technology which is capable of printing ultra-fine dots of die-attach material. For this technology an embossed transparent carrier mask (see figure below) is filled with the die attach material, which is then transferred using a single laser pulse. A crucial part of this is the correct and reproducible filling of the carrier mask. In order to optimize this filling process, an automatic coating setup has been designed and built. The goal of this internship is to use the automatic coating setup to optimize the filling parameters and then based on the findings to oversee the design and building of a dedicated filling tool for further development of the process.
What we expect from you
As a team member your tasks will be:
Knowledge acquisition through literature survey and discussion with other team members; Performing experiments in clean-room labs; Analysis of the experimental data and presentation thereof; Documenting results in a technical report and taking part in technical meetings, internal seminars/colloquiums.You are an ambitious hands-on student from mechanical engineering, materials science or (applied) physics. You have good communication skills in English and you are independent, but also a team player. This student projects will be an internship with a preferable total duration of 9 months (with the least period of 6 months). If you are looking forward to work in a challenging atmosphere with highly skilled co-workers, then please apply for this vacancy now.
What you'll get in return
You want to work on the precursor of your career; a work placement gives you an opportunity to take a good look at your prospective future employer. TNO goes a step further. It’s not just looking that interests us; you and your knowledge are essential to our innovation. That’s why we attach a great deal of value to your personal and professional development. You will, of course, be properly supervised during your work placement and be given the scope for you to get the best out of yourself. Naturally, we provide suitable work placement compensation.
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