IC Package Development Engineer

4 weken geleden

Nijmegen, Gelderland, Nederland HIP BV Voltijd

Job Title: IC Package Development Engineer

About the Role:

We are seeking an experienced IC Package Development Engineer to join our team at HIP BV. As a key member of our engineering team, you will be responsible for leading the development of our package portfolio, supporting NPI from concept through production release.

Key Responsibilities:

  • Developing Backend Assembly Process and/or Package Developments for RF Power products as Technical Lead or Project Manager
  • Work with Product Design, Quality & Reliability, Failure Analysis, Supply Chain, and our OSAT's to develop and qualify packaging technologies and assembly processes, with focus on performance, cost (DFM), and quality
  • Guidance of the design community in package/material sections and support in initial sample making (proto-line)
  • Creation, regular review and updating of design & equipment process FMEA and control plans and design rules
  • Technical support on Manufacturing with troubleshooting and providing technical solution
  • Perform continuous improvement activities of existing assembly processes, equipment and materials for yield & quality improvements as well as cost savings
  • First point of contact towards OSAT's for technical aspects

Requirements:

  • BS, MS and PhD preferably in Chemistry, Organic Chemistry, Chemical Engineering, Material Engineering, Material Science, Applied Science, or other relevant qualification
  • Minimum 5+ years of relevant experience in the function of package and assembly process development such as die attach, SMT, Lid attach, wire bonding and molding
  • Possess in depth technical knowledge and hands on experience on semiconductor backend assembly processes for RF Power Packages
  • Hands on experience on engineering methods such as FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D methodology and DoE.
  • Proven experience in project management, document accurately, communicate with intention, report efficiently, pre-empt risk, and drive for the best possible outcome for the customer, for the company, and for the team members
  • Solid experience and technical understanding in semiconductor reliability standards and test methods
  • Experience in materials characterization and analysis, DOE, reliability standards, and FA technique is preferred
  • Experience in low, medium and high-volume manufacturing for high RF Power Products is preferred
  • Extensive experience in collaborating and driving OSATs in all stages of process development and technology transfer
  • Strong background in statistical analysis and proficient in the use of statistical analysis software packages such as JMP
  • Familiar with design tools such as AutoCad or other design tools
  • Good analytical and problem solving skills with a keen attention to details
  • Excellent written and verbal communication skills (English)
  • Ability to thrive in a fast-paced, result oriented growth business
  • Ability to work in the situation with uncertainty with minimum guideline

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