IC Package Development

3 weken geleden

Nijmegen, Nederland HIP BV Voltijd

The IC Package Development / Assembly Engineer Technical will lead the development of our package portfolio, supporting NPI from concept through production release. He will provide direction to product- and design engineers for optimum performance while ensuring, cost effective and well manufacturable packaging solutions. Next to this will he guide our OSAT’s and support our Proto Line from initial sampling to high volume manufacturing. Package types include plastic molded leadframe packages, ceramic packages and air cavity plastic packages for high power RF and Microwave IC’s.


Functieomschrijving
  • Developing Backend Assembly Process and/or Package Developments for RF Power products as Technical Lead or Project Manger
  • Work with Product Design, Quality & Reliability, Failure Analysis, Supply Chain, and our OSAT’s to develop and qualify packaging technologies and assembly processes, with focus on performance, cost (DFM), and quality
  • Guidance of the design community in package/material sections and support in initial sample making (proto-line)
  • Creation, regular review and updating of design & equipment process FMEA and control plans and design rules
  • Technical support on Manufacturing with troubleshooting and providing technical solution
  • Perform continuous improvement activities of existing assembly processes, equipmentand materials for yield & quality improvements as well as cost savings
  • First point of contact towards OSAT’s for technical aspects

Functie-eisen
  • BS, MS and PhD preferably in Chemistry, Organic Chemistry, Chemical Engineering, Material Engineering, Material Science, Applied Science, or other relevant qualification
  • Minimum 5+ years of relevant experience in the function of package and assembly process development such as die attach, SMT, Lid attach, wire bonding and molding
  • Possess in depth technical knowledge and hands on experience on semiconductor backend assembly processes for RF Power Packages
  • Hands on experience on engineering methods such as FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D methodology and DoE.
  • Proven experience in project management, document accurately, communicate with intention, report efficiently, pre-empt risk, and drive for the best possible outcome for the customer, for the company, and for the team members
  • Solid experience and technical understanding in semiconductor reliability standards and test methods
  • Experience in materials characterization and analysis, DOE, reliability standards, and FA technique is preferred
  • Experience in low, medium and high-volume manufacturing for high RF Power Products is preferred
  • Extensive experience in collaborating and driving OSATs in all stages of process development and technology transfer
  • Strong background in statistical analysis and proficient in the use of statistical analysis software packages such as JMP
  • Familiar with design tools such as AutoCad or other design tools
  • Good analytical and problem solving skills with a keen attention to details
  • Excellent written and verbal communication skills (English)
  • Ability to thrive in a fast-paced, result oriented growth business
  • Ability to work in the situation with uncertainty with minimum guideline

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