Chemical Engineering Internship: Debonding of Adhesives
3 weken geleden
ASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.
Your AssignmentIn this internship, you will focus on debonding epoxy glue connections and removing glue remnants from sensor parts. This requires a dedicated debonding process, taking into account particle defectivity and outgassing. You will investigate available debonding processes, determine specifications, and conduct experiments to improve the debonding process.
Deliverables- Literature study on available debonding processes for specific epoxy adhesives
- Investigation of experimental knowledge collected by the industrial partner and ASML's glue competence group
- Determination of specifications for the debonding process
- Conducting experiments to improve the debonding process
- Verification of results against defined specifications
- Reporting on results with conclusions and recommendations
To be considered for this role, you should have:
- A Master's degree in chemistry, materials science, or equivalent expertise
- An interest in making a positive impact on sustainability
- A self-propelling, solution-oriented, and communicative approach with a hands-on mentality
This is a 5-day-a-week internship for 5-9 months, starting in September. You will work in a dynamic team environment and gain valuable experience in a highly innovative environment.
About ASMLASML is a global industry leader in high-tech manufacturing, headquartered in the Netherlands. We develop complex lithography machines that chipmakers use to produce integrated circuits. Our company values diversity and inclusion, and we believe in the importance of a diverse and inclusive workforce.
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Chemical Engineering Internship: Debonding of Adhesives
1 maand geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentIn this internship, you...
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Chemical Engineering Internship: Debonding of Adhesives
4 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentIn this internship, you...
-
Chemical Engineering Internship: Debonding of Adhesives
3 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentIn this internship, you...
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Chemical Engineering Internship: Debonding of Adhesives
2 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentIn this internship, you...
-
Chemical Engineering Internship: Debonding of Adhesives
3 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentThis internship focuses...
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Chemical Engineering Internship: Debonding of Adhesives
4 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair.Your AssignmentIn this internship, you...
-
Chemical Engineering Internship: Debonding of Adhesives
4 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair.Your AssignmentAs part of this effort, you...
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Chemical Engineering Internship: Debonding of Adhesive Bonds
1 week geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest and reuse individual parts from these systems.Your AssignmentAs part of this...
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Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair. Part of their development portfolio are...
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Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, focuses on designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair.Image sensors, a key part of the development...
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Chemical Engineering Internship: Debonding of Adhesive Bonds
1 week geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group is part of the Mechanical Development cluster and is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentTo achieve this...
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