Chemical Engineering Internship: Debonding of Adhesives
3 weken geleden
ASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.
Your AssignmentThis internship focuses on debonding epoxy glue connections and removing glue remnants from sensor parts. The debonding process must be suitable for extremely clean and vacuum environments. ASML collaborates with an industrial partner to achieve this goal.
Key Responsibilities- Conduct a literature study on available debonding processes for specific epoxy adhesives
- Investigate experimental knowledge collected by the industrial partner and ASML's glue competence group
- Determine specifications for the debonding process, considering particle defectivity and outgassing
- Determine suitable debonding processes and conduct experiments, potentially improving the most suitable process
- Verify debonding experiment results against defined specifications
- Report on results, conclusions, and recommendations
To be considered for this role, you:
- Are a Master's student with a background in chemistry, materials science, or equivalent expertise
- Have an interest in making a next step in reuse and sustainability
- Are self-propelling, solution-oriented, communicative, and proactive, with a hands-on mentality for conducting glue experiments and analyses
This is a graduation/apprentice internship for 5 days a week, with a duration of 5-9 months, starting in September. You must be enrolled at a school for the entire duration of the internship.
What We OfferAs an intern at ASML, you'll gain valuable experience in a highly innovative environment, working with experts in the field. You'll receive a monthly internship allowance of maximum €600, plus possible housing allowance and free public transport. You'll also have the chance to work in a dynamic team environment and contribute to the company's mission to make progress.
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Chemical Engineering Internship: Debonding of Adhesives
1 maand geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentIn this internship, you...
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Chemical Engineering Internship: Debonding of Adhesives
4 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentIn this internship, you...
-
Chemical Engineering Internship: Debonding of Adhesives
3 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentIn this internship, you...
-
Chemical Engineering Internship: Debonding of Adhesives
3 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentIn this internship, you...
-
Chemical Engineering Internship: Debonding of Adhesives
2 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationASML's Sensors Mechanics group is part of the Mechanical Development cluster, responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentIn this internship, you...
-
Chemical Engineering Internship: Debonding of Adhesives
4 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair.Your AssignmentIn this internship, you...
-
Chemical Engineering Internship: Debonding of Adhesives
4 weken geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair.Your AssignmentAs part of this effort, you...
-
Chemical Engineering Internship: Debonding of Adhesive Bonds
1 week geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest and reuse individual parts from these systems.Your AssignmentAs part of this...
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Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair. Part of their development portfolio are...
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Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group, part of the Mechanical Development cluster, focuses on designing optical sensor systems, including wafer height measurement systems and image sensors. To reduce waste and increase sustainability, the group aims to harvest individual parts for reuse or repair.Image sensors, a key part of the development...
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Chemical Engineering Internship: Debonding of Adhesive Bonds
1 week geleden
Eindhoven, Noord-Brabant, Nederland ASML VoltijdBackground InformationThe Sensors Mechanics group is part of the Mechanical Development cluster and is responsible for designing optical sensor systems, including wafer height measurement systems and image sensors. The group aims to reduce waste and increase sustainability by harvesting individual parts for reuse or repair.Your AssignmentTo achieve this...
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