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IC Package Development Engineer
2 maanden geleden
We are seeking a highly skilled IC Package Development Engineer to join our team at HIP BV. As a key member of our engineering team, you will be responsible for leading the development of our package portfolio, supporting NPI from concept through production release.
Key Responsibilities:- Develop and implement backend assembly processes and package developments for RF Power products as a technical lead or project manager.
- Collaborate with product design, quality, reliability, failure analysis, supply chain, and OSATs to develop and qualify packaging technologies and assembly processes, focusing on performance, cost, and quality.
- Provide guidance to the design community on package and material sections, and support initial sample making (proto-line) activities.
- Develop, review, and update design and equipment process FMEA and control plans, as well as design rules.
- Offer technical support on manufacturing, troubleshooting, and providing solutions.
- Perform continuous improvement activities to enhance existing assembly processes, equipment, and materials for yield and quality improvements, as well as cost savings.
- Serve as the primary point of contact for OSATs on technical aspects.
- Bachelor's, Master's, or Ph.D. in Chemistry, Organic Chemistry, Chemical Engineering, Material Engineering, Material Science, Applied Science, or a relevant field.
- Minimum 5+ years of experience in package and assembly process development, including die attach, SMT, lid attach, wire bonding, and molding.
- Deep technical knowledge and hands-on experience in semiconductor backend assembly processes for RF Power Packages.
- Experience with engineering methods such as FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D methodology, and DoE.
- Proven project management experience, including documentation, communication, reporting, risk management, and driving outcomes for customers, the company, and team members.
- Solid experience and understanding of semiconductor reliability standards and test methods.
- Experience in materials characterization and analysis, DOE, reliability standards, and FA techniques is preferred.
- Experience in low, medium, and high-volume manufacturing for high RF Power Products is preferred.
- Extensive experience in collaborating and driving OSATs in all stages of process development and technology transfer.
- Strong background in statistical analysis and proficiency in statistical analysis software packages such as JMP.
- Familiarity with design tools such as AutoCad or other design tools.
- Excellent analytical and problem-solving skills, with a keen attention to detail.
- Excellent written and verbal communication skills in English.
- Ability to thrive in a fast-paced, result-oriented growth business.
- Ability to work in uncertain situations with minimal guidelines.
