IC Package Development Engineer

1 maand geleden

Nijmegen, Gelderland, Nederland HIP BV Voltijd
Job Title: IC Package Development

We are seeking a highly skilled IC Package Development Engineer to join our team at HIP BV. As a key member of our engineering team, you will be responsible for leading the development of our package portfolio, supporting NPI from concept through production release.

Key Responsibilities:
  • Develop and implement backend assembly processes and package developments for RF Power products as a technical lead or project manager.
  • Collaborate with product design, quality, reliability, failure analysis, supply chain, and OSATs to develop and qualify packaging technologies and assembly processes, focusing on performance, cost, and quality.
  • Provide guidance to the design community on package and material sections, and support initial sample making (proto-line) activities.
  • Develop and maintain design and equipment process FMEA and control plans, as well as design rules.
  • Offer technical support on manufacturing, including troubleshooting and providing technical solutions.
  • Perform continuous improvement activities to enhance existing assembly processes, equipment, and materials for yield and quality improvements, as well as cost savings.
  • Serve as the primary point of contact for OSATs on technical matters.
Requirements:
  • Bachelor's, Master's, or Ph.D. in Chemistry, Organic Chemistry, Chemical Engineering, Material Engineering, Material Science, Applied Science, or a related field.
  • Minimum 5+ years of experience in package and assembly process development, including die attach, SMT, lid attach, wire bonding, and molding.
  • Deep technical knowledge and hands-on experience in semiconductor backend assembly processes for RF Power Packages.
  • Experience with engineering methods such as FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D methodology, and DoE.
  • Proven project management experience, including accurate documentation, effective communication, efficient reporting, risk anticipation, and driving outcomes for customers, the company, and team members.
  • Strong understanding of semiconductor reliability standards and test methods.
  • Experience in materials characterization and analysis, DOE, reliability standards, and FA techniques is preferred.
  • Experience in low, medium, and high-volume manufacturing for high RF Power Products is preferred.
  • Extensive experience in collaborating with and driving OSATs in all stages of process development and technology transfer.
  • Strong background in statistical analysis and proficiency in statistical analysis software packages such as JMP.
  • Familiarity with design tools such as AutoCad or other design tools.
  • Excellent analytical and problem-solving skills, with a keen attention to detail.
  • Excellent written and verbal communication skills (English).
  • Ability to thrive in a fast-paced, result-oriented growth business.
  • Ability to work in uncertain situations with minimal guidelines.

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