Backend Assembly Process Developer for High Power RF and Microwave ICs
3 dagen geleden
HIP BV is a leading company in the development of high power RF and microwave ICs, seeking a skilled Backend Assembly Process Developer to join our team. The successful candidate will be responsible for developing backend assembly processes and package developments for high power RF and microwave ICs.
About the Role- Develop and implement backend assembly processes and package developments for high power RF and microwave ICs
- Collaborate with product design, quality and reliability, failure analysis, supply chain, and OSATs to develop and qualify packaging technologies and assembly processes
- Provide technical guidance and support to the design community in package and material sections
- Creation and regular review of design and equipment process FMEA and control plans
- Technical support on manufacturing with troubleshooting and providing solutions
- Bachelor's or master's degree in chemistry, organic chemistry, chemical engineering, materials engineering, materials science, applied science, or relevant field
- Minimum 5+ years of experience in backend assembly process development and package development for high power RF and microwave ICs
- Hands-on experience in semiconductor backend assembly processes, including die attach, SMT, lid attach, wire bonding, and molding
- Proven experience in project management, document creation, communication, reporting, risk identification, and problem-solving
- Experience in statistical analysis and proficiency in JMP software
- Competitive salary: €80,000 - €110,000 per year
- Opportunities for professional growth and development
- A dynamic and collaborative work environment
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